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AG TERMOPASTY ART.AGT-108 | Heat transfer paste; grey; stainless steel particles,silicone

HELUKABEL 46409 | Wire; SiD; solid; Cu; 0.75mm2; silicone; orange; -60?180?C; 100m

MICROCHIP (MICROSEMI) A3P060-VQ100I | IC: FPGA; SMD; VQFP100; Number of macrocells: 1536; I/O: 71; 231MHz

OMRON OCB G5V-2-H 5VDC | Relay: electromagnetic; DPDT; Ucoil: 5VDC; Icontacts max: 2A; PCB